Investigating options for thermal treatment of printed circuit board waste
Grant holder: Prof C Dorfling
Institution: Stellenbosch University
Duration: 30 January 2019 to 31 March 2020
Project outline: The project aims to compare different printed circuit board (PCB) waste thermal treatment technologies based on techno-economic analyses and to evaluate the potential advantages of thermal pre-treatment for downstream metal recovery processes.
|»||Conference: van Zyl, HA. et al. (2019). Influence of thermal treatment processes of printed circuit board waste on hydrometallurgical metal recovery process. SAIMM Western Cape Mineral Research Showcase, 2019.|